We provide chip cooling area and temperature-up coefficients to convert to each other. With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller, while the computing speed is faster and faster, the heat generation is also more and more, which puts forward higher requirements for the chips cooling. Designers must use advanced thermal technology and high-performance thermal materials to effectively remove heat, to ensure that the chip can withstand the maximum temperature to work properly.